Etching:

Etching is a critical process control point during the manufacturing of semicomductor chips. Processes such as dry etching and photoresist removal are often accompanied by high temperatures enhanced by plasma and chemical corrosion. Ordinary materials typically struggle to meet such demanding requirements. Honseal products, with their excellent chemical resistance, high-temperature durability, low outgassing, and minimal metal ion contamination, are widely used in the most advanced semiconductor chip manufacturing equipments.

Wet Process:

The semiconductor wet process involves a wide variety of media with complex application conditions, while also needing to balance cost considerations. Honxin FFKM provides products designed to resist a broad range of chemical media, suitable for static, dynamic, and composite applications in processes like wet etching, CMP, and spin coating development.

Thin Film Deposition, Thermal Process:

Honseal products exhibit outstanding temperature resistance. Whether in HDPCVD, PECVD, PVD, or high-temperature processes such as LPCVD, oxidation, diffusion, and RTP, they maintain low outgassing rates, meeting customer requirements for high-temperature rubber materials.